Products

Performa nce Index

Domestic  substrate

Peeling strength(n/mm）

1.8

Insulation resistance（ω）

>1*10g

Breakdown voltage（vdc）

4k

Soakable soldering（℃/m）

280℃,1min,no bubble, delamination

Thermal conductivity（w/m-k）

>0.8

Thermal resistance  （℃/w）

<1.2

Combustibility

v-o

Dielectric constant（1mhz）

4

Dielectric loss angle(tangent)

0.03

items

Ability

Product model

Alsubstrate cusubstra te

Material model

Domestical imported al

Surface disposal

Spray tin/chemical tin/chemical Gold/osp/ immersion tin

Layers

Single-side  alsubstrate /double-side Alsubstrate /four-layer al substrate

Maximum measurement

1100mm*480mm

Minimum measurement

5mm*5mm

Line width/space

0.1mm

Warp and twist

≤0.5%(thickness:1.6mm,

Measurement:300mm×300mm)

Processing thickness

0.3－4.5mm

Copper foil thickness

35um  70um  105um  140um

Molding dimension tolerance

±0.15mm

V-cut positioning accuracy

±0.1mm

Processing capability

6000m2

Cu thickness of inner aperture

20-25um

Aperture location deviation

±0.076mm

Minimum diameter of piercing

Lower than1.0mm 1.0mm

span style='mso-ignore:vglayout;;z-index:1;left:0px;margin-left: -7px;margin-top:5px;width:253px;height:2px'1.2-3.0mm 1.5mm

Minimum specification of  the square groove

Plate-thickness

span style='mso-ignore:vglayout;;z-index:2;left:0px;margin-left: -7px;margin-top:15px;width:253px;height:3px'wer than 1.0mm 0.8mm×0.8mm

Plate-thickness:

1.2-3.0mm 1.0×1.0mm

Circuit printing deviation

±0.076mm

Scope of molding dimension tolerance

CNC：±0.1mm punching the shape：

±0.15mm

Mini aperture

0.8mm not limited to the maximum

aperture diameter

Coating thickness

Gold plating：

Ni 2.5-5um Au 0.05-0.1um & 0.025－0.075um

Immersion gold:

Ni 5-8um Au0.08-0.1um

Spray tin 3-30um 4-30um

V－cut angle deviation

±5°

Scope of v-cut plates

0.6mm-3.2mm

Marking fond of smallest component

0.15mm

Smallest windowing of pad

0.01mm