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Capability
Item |
Craft |
NO. LAYER |
1-28 layers |
FINISHED BOARD SIZE (MAX) |
23inch X 41inch (584.2mm X 1041.4mm) |
FINISHED BOARD SIZE (MIN) |
1inch X 1.2inch(25.4mm X 30.48mm) |
BOARD THICKNESS (MAX) |
0.236inch (6.0mm) |
BOARD THICKNESS (MIN) |
0.016inch (0.40mm) |
T/C THICKNESS |
0.0039inch (0.10mm) |
FINISHED BOARD THICKNESS TOLERANCE (BOARD THICKNESS ≧0.8mm) |
+/-10% |
FINISHED BOARD THICKNESS TOLERANCE (0.4mm≦BOARD THICKNESS<0.8mm) |
+/-3mils(+/-0.075 mm) |
WARPAGE (MAX) |
0.5% |
DRILLED HOLE DIAMETER (MAX) |
6.70mm |
DRILLED HOLE DIAMETER (MIN) |
0.1mm |
FINISHED HOLE DIAMETER (MIN) |
0.075mm |
OUTER LAYER BASE COPPER THICKNESS (MIN) |
1/3 oz (0.012mm) |
OUTER LAYER BASE COPPER THICKNESS (MAX) |
6 oz (0.21mm) |
INNER LAYER BASE COPPER THICKNESS (MIN) |
0.5 oz (0.017mm) |
INNER LAYER BASE COPPER THICKNESS (MAX) |
6 oz (0.21mm) |
INNER LAYER DIELECTRIC THICKNESS (MIN) |
0.0039inch (0.10mm) |
DIELECTRIC MATERIAL (MIN) |
CEM-3 FR4(130℃ Tg) Rogcrs4003 FR4(140℃ Tg) FR4(150-170℃ Tg) |
HOLE PLATING ASPECT RATIO (MAX) |
6 : 1 |
HOLE DIAMETER TOLERANCE (PTH) |
+/-3mils(Batch Process) |
HOLE DIAMETER TOLERANCE (NPTH) |
+/-2mils(Batch Process) +/-1mils(Special Requirement) |
OUTER LAYER LINE WIDTH/SPACING (MIN) |
T/T oz is 4mil/4mil(T 1/3 oz) |
INTER LAYER WIDTH/SPACING (MIN) |
H/H oz is 4mil/4mil 1/1 oz is 4mil/4mil |
SOLDERMASK THICKNESS (MIN) |
10 um |
SOLDERMASK PLUG HOLD DIAMETER |
≧0.75mm Hole Soft Soldering |
IMPEDANCE TOLERANCE (MIN) |
+/-10% |
Surface Processing |
1. Hot Air Leaving |
THERMAL STRESS TEST |
288℃ 10 sec |
FLAMMABILITY |
94V-0 |
IONIC CONTAMINATION |
≦10ug/in2 |
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PCB